Expertise in components
With more than 20 years of experience in the field and having performed thousands of analyses, we now have a unique expertise that enables us to work on all types of electronic components, circuit boards and systems.
We offer a range of expertise in order to check and characterise your products.
DPA & Construction analysis:
DPA: Quality analysis for your products with respect to MIL or ESA/ESCC standards.
Construction analysis: Quality analysis for your products with respect to the state of the art.
All of these analyses are performed through non-destructive inspections such as visual inspections, radiography or acoustic microscopy, and destructive inspections such as microsectioning, shear testing, tensile testing, weldability, etc.
In order to determine the failure modes and mechanisms, we offer electrical and physical analyses on the components.
We have multiple means of sample preparation, observation and analysis:
- Electrical testing
- Optical microscopy
- Acoustic microscopy
- 2D and 3D X-ray – X-ray laminography
- Infrared thermography
- Package opening (mechanical, chemical, etc.)
- Slice and view
- SEM observations (Scanning Electron Microscopy)
- EDX materials analysis
- TEM observation (Transmission Electron Microscopy)
- Fault location