ETM & Industrialization

It is necessary to integrate the constraints associated with the technologies and manufacturing processes used, to achieve the optimum quality and reliability of the products to be assembled, and to identify the best manufacturing processes.

Placement / layout optimization

Critical analysis of electronic board placement and layout, taking into account best practices and potential risks for components.

Assembly process selection

Board and system assembly process selection based on the following criteria: quality, capacity, cost, durability, equipment performance, etc.

Elimination of quality and reliability risks induced by the different assembly processes (ESD, MSL, cracking, delamination, corrosion, oxidation, pollution, thermal and mechanical stress, etc.)

Subcontractor selection

Use of an evaluation procedure to select subcontractors able to manufacture an electronic board or a system: process management and monitoring, knowledge of technologies and associated risks, equipment capabilities, engineering and production expertise, flow management, etc.

Test solutions

In order to exclude potential failure, definition of a test strategy for manufactured products: functionality and in situ tests, flying probe, boundary scan, burn-in, among others.