Transmission Electron Microscopy (TEM)


Transmission Electron Microscopy (TEM) in Serma Technologies offers a wide variety of services and analyses of microstructures down to the atom level.

Typical analyses include structural characterization and elemental composition of various materials such as semiconductors (Si, Ge, GaAs, etc), metals and alloys, carbon composite, quartz, etc…

> TEM Portfolio


Sample preparation for the TEM Observation :

Techniques :

> Tripod polishing
> Ion polishing Ar+
> Focussed Ion Beam (FIB) thinning

- direct extraction of the TEM lamella from a package, an encapsulated micro-section, a device, etc…
- accurate targeting of the TEM lamella localization within a sample

 

Equipments :

FIB 200 FEI (Electron Microscopy)

• Inversed optical microscope, Tripod, Polishing machines…
• Ion polishing system Ar+ :
Duomill, Precision Ion Polishing System Gatan (PIPS)
• Ionic polishing systems Ga+ :
Focused Ion Beam (FIB) 200 FEI single beam,
STRATA 400 FEI double beam (FIB/MEB).

 

 

 

 

TEM Analysis :

Microscopie électronique

Techniques :

• Conventional and high resolution imaging
• Electron diffraction
• Scanning transmission electron microscopy (STEM)
• X-ray Energy Dispersive Spectroscopy (X-EDS)
• Spectroscopy & elemental mapping using electron energy loss spectroscopy (EELS & EFTEM)

 

 

 



Equipment's specifications :

• Transmission Electron Microscope JEOL 2010 FEF :
• Transmission Electron Microscope FEI TECNAI G2 F20 S-TWIN :
Accelerating voltage : 200kV
Field emission gun (FEG) Schottky
Sample tilt angle (double-tilt sample arm) : ±25°
TEM : Point to point resolution : 0.19 nm ;
Plan to plan resolution : 0.1 nm ;
STEM : Annular dark field and bright field detectors
HAADF detector with atomic resolution
STEM HAADF resolution : 0.34 nm
X-EDS : EDAX UTW (Si) Detector
INCA EDS System from Oxford Instruments
EELS : Omega type filter
Spectroscopy resolution < 2eV
Accelerating voltage : 200kV
Field emission gun (FEG) Schottky
Sample tilt angle (double-tilt sample arm) : ±40°
TEM : Point to point resolution : 0.24 nm ;
Plan to plan resolution : 0.102 nm ;
STEM : Annular dark field and bright field detectors
STEM HAADF resolution : 0.19 nm
X-EDS : EDAX UTW (Si) Detector
Acquisition software: Emispec Vision™

Electron Microscopy


Contact

BHT – Bâtiment 52 - 7, Parvis Louis Néel
BP 50 - 38040 Grenoble Cedex 9
Téléphone : + 33(0)4 38 02 36 80
Fax : + 33 (0)4 76 96 25 40

Grenoble Laboratory Manager :

M. Laurent Callet
Tel : 00 33 (0)4 38 02 36 81
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