Level 2 : Quality
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( wetting balance test): check the quality of leads coating (oxidation, corrosion or pollution). Due to an extended storage period or poor storage conditions, the lead coating damage can cause problems during parts assembling. Optional cross-section can be performed to verify intermetallics growth. |
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(non-destructive ultra-sonic imaging): check the plastic packages integrity in order to evaluate the risk of delamination. Due to storage conditions, dismounting and delamination of parts (die/bonding areas detached from plastic) can generate open circuits or faulty connections as a result of mechanical and thermal stress during assembling and parts running on the final application. |
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Search for input or output defects, open circuit, short circuit, damaged protection diodes, leakage current) and compare signals with connections pins indicated on component datasheet.
Depending on component type and SERMA Technologies test solutions developed by our Failure Analysis Unit and our Electrical Expertise Laboratory:
Measurement of main parameters in order to check component electrical performance at functioning points indicated on the manufacturer datasheet. |
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 For all memory types, FPGA/EPLD/PAL programmable logical devices and micro controllers (in cooperation with a programming centre using DATA I/O Corporation and SYSTEM GENERALalgorithms): Identity Die check, blank check of memory blocks (including all One Time Programmable regions), programming and erasing tests. Other integrated circuits – Parametric I(V) testing + Standby supply current measurement + check of one component functionality (truth table, switching of amplifiers for OPAs, Output voltage measurement for voltage regulators…). |
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