Search for the component history:

Detect re-marking / falsification traces:
surface aspect (polishing or blacktopping traces), marking permanency test, checking any previous markings…





X-Rays analysis: check internal construction and
lot homogeneity.

Check the die: functional opening, internal
inspection & die markings.

Compare with reference component if available
and with our database including analysis performed by SERMA Technologies over more than 10 years.

First level analysis of defects – leads, cracks, weakness of internal wires bonding, assembly defects, die defects (pad corrosion, electrical overstress…).