Lot Screening

Even if the defects are detected at Level 1 or Level 2, the lot could contain good parts. The final customer can purchase the lot containing defective parts, because these components are hard to find. The customer has to screen the lot in order to remove defective parts before storage in order to guarantee the components  reliability.
Our goal is to assist our customers in this approach by establishing a group of tests, for example:

External visual inspection of all parts: to remove the parts with bad marking, damaged, corroded or contaminated leads, cracked package…

X-Rays inspection of all parts: to check the die size, internal wires, die attachment quality...

Acoustic microscopy of all parts: to remove unacceptable delaminated part.

Electrical testing of all parts: functional test  if required at the limits of component specification  based on existent test solutions or specific solutions  developed by a test team.

Assembly simulation and cycling ageing tests: to simulate the stress the components will be subjected to (during assembly process or when using on the application) followed by acoustic microscopy, internal wires pull tests or functional electrical tests.

Leads re conditioning (in an assembling/manufacturing plant): to re-tin leads showing coating weakness during solderability test or to repair bent leads.

In addition to BROKER lots testing, SERMA Technologies can assist its customers in purchasing of electronic components:

X-Ray Fluorescence: to guarantee the leads coating is Pb-free of the final application.

Re-conditioning: to deliver parts in reel tapes or in tubes as required by manufacturing equipment.

Components baking: SERMA Technologies recommends to bake the lots of unknown origin before assembly process. It is not possible to guarantee that parts were correctly stored after being manufactured, even if they were received in dry-pack with desiccant and humidity indicator. Due to incorrect storage, the humidity can cause major defects on die and internal wires bondings that will generate open circuits or faulty connections. SERMA Technologies can bake components for the customer before delivery in dry-packs.

Lifecycle Management and Obsolescence Risk Processing:
the Electronic Consulting Team can assist customers in their BOM obsolescence management, periodical analysis of obsolescence risks, Process Change Notification and Quality alarm processing. We can propose a support if the obsolescence is confirmed, including parts searching through BROKERS, selection of potential cross-reference components with shift analysis, partial or complete re-design of a component or electronic function.