Failure analysis

Failure analysis on integrated circuits

Objective :

Find the failure mechanism of a product so as to determine the origin of the problem and to provide the corrective actions.

• Type of failure intrinsic to the circuit (short-circuit, open circuit , over consumption…)
• Characterization / Failure reproduction.
• Locating the failure (optical observation, hot spots (liquid cristal)
• Determining failure mechanism (FIB microsection, mechanical microsection, deprocessing)
• Proposal of corrective actions.

Means :

• Electrical testing of inputs
• Optical observations
• Acoustic microscopy
• Opening
• Microsection
• MEB observations (Scanning Electron Microscope)
• EDX Observations
• X-Ray
• Failure location
• Optical observations of the IC