Expertise - Characterization

Reliability tests and process characterization for semiconductors

Establish reliabilty parameters and models for the process semiconductors facing the main failure mechanisms which they could be subjected to within the ICs.

• Interconnections process : electromigration tests
• MOS transistors : hot-carrier tests
• Bipolar transistors : speed-up tests
• Dielectric : voltage break tests, Time Dependant Dielectric Breakdown (TDDB).

Equipment :

Système dédié Qualitau Inc. Modular Integrated reliability Analyser (MIRA)

Norme :

EIA / JEDEC, AEC-Q100